Ball Grid Array (BGA) represents the most effective technological innovation for attaching chips to a circuit board. ACDi assembles BGA boards using an in-house complex BGA surface mount technology (SMT). Our SMT will produce 1600 pin and 0.5 mm pitch configurations. We also offer supplemental BGA in-house services, such as the inspection of BGA assemblies using our CR Technology CRX Series X-Ray machine and BGA repair using our Air Vac BGA Rework machine.

Our BGA services include fulfilling standard packages and developing custom packages, such as 50mm x 50mm, 2401 ball counts. We provide lead, hi-temperature, lead-free and fine pitch BGAs (down to 0.5). We also perform lead-free to leaded conversions.

Our x-ray services support the types of complicated boards that we are known to design; those, which utilize advanced board technology. We are able to detect "shorts", inspect BGA's that are placed back-to back and provide image analyses with image resolutions of 22um. Our system does not include an auto-programming option. We achieve high magnification due to the fixed detector design. Void calculations are done manually and are only apparent on voids >20%.