ACDi Case Studies

NPI Program Requires Quick Reaction Time

The defense market has become exceedingly competitive and has created a demand for ultra-quick turns in the electronics manufacturing services industry. One of our clients has come to repeatedly depend on ACDi to deliver fast turn arounds for their critical circuit card assembly requirements. For our client, new product introduction (NPI) success requires that: They receive […]

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Design Solutions for Fine Pitch BGA

ACDi’s engineering services team is constantly working with our customers to produce reliable PCB designs with the lowest fabrication costs for our customers.  A recent design highlights ACDi’s expertise in the routing of fine pitch BGAs, and the extra effort to reduce a customer’s board costs by up to 20%. Problem: Our customer came back […]

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Medical Rehabilitation Device

ACDi partnered with a medical rehabilitation device firm to assist in the development of  a controller used in conjunction with a monitor for Ergometers  utilizing functional electrical stimulation (FES).  The FES ergometer provides electrical impulses to stimulate muscles that have    diminished nervous control and are at risk for atrophy, circulation issues, muscle spams, and […]

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CompactPCI Test Fixture

The CompactPCI Test Fixture is a debug and test suite designed specifically for the development, integration and test of a customer developed CompactPCI card.  The CompactPCI Test Fixture is used to verify power, interfaces, and all IO to the device under test.  The CompactPCI Test Fixture also provides powerful processing platforms and  integrated   displays that aid the […]

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Electronic Product Design: Prototype to Production

This highly capable Event Monitoring Device is for use in elevator and escalator systems.  Not only does it monitor seismic events, but its added capability also allows for the addition of remote and auxiliary sensors. For seismic event monitoring this device uses sophisticated digital processing to trigger on events in accordance to the ASCE 25-97 […]

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Engineering Tech Brief: Better PCB Design using Stacked Vias

As modern electronic product form factors continue to shrink at the same time as physical component geometries become increasingly dense, the demands of routing complex components become progressively more difficult. This is often observed in designs incorporating high pin count FPGAs and fine pitch BGAs which require that fanouts be designed to access all of the device’s pins. In high density designs, the popular use of through-hole vias may consume too much space to be practical. For many of the current designs, effective PCB trace routing requires the use of a new design approach… these designs required the use of a stacked via.

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Telecom OEM Transfers all Production to EMS ACDi

ACDi has successfully completed the migration of manufacturing from a local OEM into our state of the art electronics manufacturing facility in Frederick, MD. ACDi now builds all of the OEM’s printed circuit board assemblies (PCBA’s), performs functional test and / or flying probe test on the PCBA’s, assembles the boards into box level chassis products, performs top level calibration and functional test, and packages the products for shipment to the OEM’s customers.

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